The Directory for Semiconductor Equipment, Materials and Service Suppliers

Main Index > Assembly Equipment Manufacturers

Industry Organizations



Advanced Packaging Magazine
Chip Design Magazine
Cleanroom Technology
European Semiconductor
Future Fab
III-Vs Review
Semiconductor Intl.
Semiconductor Mfg.
Solid State Technology


Semicon Taiwan 2009
September 30 -October 2, 2009, Taipei World Trade Center, Taiwan

Semicon Europa 2009
October 6-8, 2009, Messe Dresden Germany

PV Taiwan 2009
October 7-9 2009

Semicon Japan 2009
December 2 – December 4, 2009, Makuhari Messe, Chiba, Japan

Semicon Russia 2010
June 14 -16, 2010, World Trade Center, Moscow, Russia

Semiconductor Manufacturing
All about Semiconductor Industry, Semiconductor Materials, Crystal Growth and Wafer Preparation, Contamination Control, Wafer Fabrication, Process Yields, Epitaxy, Oxidation, Lithography, Reactive Plasma Etching, Film Deposition, Ion Implantation, Metallization, Wafer Test and Evaluation, Assembly and Packaging and more

Assembly Equipment Manufacturers

  • Backgrind, Slicing, Lapping, Polishing
  • Ball Placement, Attach Systems
  • Base Loader Systems
  • Cleaning,Washing Equipment for Assembly and Packaging
  • Cut and Down Set, Trim, Form Equipment
  • Deflashing, Degating Tools
  • Device Handling, Feeding Systems
  • Dicing, Sawing, Scribing, Separation Equipment
  • Die Bonding, Attach Equipment
  • Die Removal Equipment
  • Die Sorter, Pick and Place, Flip Chip Placement Systems
  • Dispensing Systems
  • Hot Embossing System
  • Lead Finishing, Straightening Equipment
  • Lead Frame Taping Systems
  • Lithography Systems for Wafer Level Packaging, Bumping, 3D Interconnect Aligners
  • Marking, Imprinting Equipment, Labeling Equipment
  • Molding, Encapsulation, Decapsulation Equipment
  • Package Handling, Conveying Equipment
  • Package Simulation, Characterization Equipment
  • Printing Equipment, Screen-printing, Alignment, Film Printing
  • PROM, Memory Programmer Equipment
  • Solder Reflow, Soldering and Brazing Equipment
  • Tape Automated Bonding (TAB), Bumped Tape Automated Bonding (BTAB) Equipment
  • Wafer Level, SOI Bonders, Temporary Bonders, DE-Bonders
  • Wafer Mount, Taping Equipment
  • Wire Bonding Equipment

  • Featured Companies

    Hologenix - Innovative Products for the Semiconductor Industry.

    WAFERMAP - Metrology Software for the Semiconductor Industry

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