Industry Organizations
FSA
IEEE
ITRS
JEITA
JEMI
MRS
SEMATECH
SEMI
SIA
Magazines
Advanced Packaging Magazine
Chip Design Magazine
Cleanroom Technology
CleanRooms
European Semiconductor
Future Fab
III-Vs Review
MICRO
Semiconductor Intl.
Semiconductor Mfg.
Solid State Technology
Events
Semicon China 2006
March 21-23, 2006
Shanghai New International Expo Center – SNIEC
Shanghai, China
FPD China 2006
March 28-30, 2006
Shanghai Mart
Shanghai, China
Semicon Europa 2006
Exhibition: 4–6 April
Programs & Events: 3–6 April
New Munich Trade Fair Centre
Munich, Germany
Semicon Singapore 2006
9-11 May 2006
Levels 4 and 6
Suntec Singapore International Convention & Exhibition Centre
Singapore
FPD Taiwan 2006
June 14–16, 2006
Taipei World Trade Center
Taipei, Taiwan
Semicon West 2006
July 10-14, 2006
Moscone Center
San Francisco, California, USA
Semicon Taiwan 2006
September 11–13, 2006
Taipei World Trade Center
Taipei, Taiwan
Semi Expo CIS Russia 2006
October 2–4, 2006
Moscow, Russia
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Assembly Equipment Manufacturers
Backgrind, Slicing, Lapping, PolishingBall Placement, Attach SystemsBase Loader SystemsCleaning,Washing Equipment for Assembly and PackagingCut and Down Set, Trim, Form EquipmentDeflashing, Degating ToolsDevice Handling, Feeding SystemsDicing, Sawing, Scribing, Separation EquipmentDie Bonding, Attach EquipmentDie Removal EquipmentDie Sorter, Pick and Place, Flip Chip Placement SystemsDispensing SystemsHot Embossing SystemLead Finishing, Straightening EquipmentLead Frame Taping SystemsLithography Systems for Wafer Level Packaging, Bumping, 3D Interconnect AlignersMarking, Imprinting Equipment, Labeling EquipmentMolding, Encapsulation, Decapsulation EquipmentPackage Handling, Conveying EquipmentPackage Simulation, Characterization EquipmentPrinting Equipment, Screen-printing, Alignment, Film PrintingPROM, Memory Programmer EquipmentSolder Reflow, Soldering and Brazing EquipmentTape Automated Bonding (TAB), Bumped Tape Automated Bonding (BTAB) EquipmentWafer Level, SOI Bonders, Temporary Bonders, DE-BondersWafer Mount, Taping EquipmentWire Bonding Equipment
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Featured Companies
Fabmation - Factory Integration Specialist.
Hologenix - Innovative Products for the Semiconductor Industry.
Asys - Logistics Systems for production of wafers, storage substrates and microsystems.
WAFERMAP - Metrology Software for the Semiconductor Industry
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