The Directory for Semiconductor Equipment, Materials and Service Suppliers

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Advanced Packaging Magazine
Chip Design Magazine
Cleanroom Technology
European Semiconductor
Future Fab
III-Vs Review
Semiconductor Intl.
Semiconductor Mfg.
Solid State Technology


Semicon Taiwan 2009
September 30 -October 2, 2009, Taipei World Trade Center, Taiwan

Semicon Europa 2009
October 6-8, 2009, Messe Dresden Germany

PV Taiwan 2009
October 7-9 2009

Semicon Japan 2009
December 2 – December 4, 2009, Makuhari Messe, Chiba, Japan

Semicon Russia 2010
June 14 -16, 2010, World Trade Center, Moscow, Russia

Semiconductor Manufacturing
All about Semiconductor Industry, Semiconductor Materials, Crystal Growth and Wafer Preparation, Contamination Control, Wafer Fabrication, Process Yields, Epitaxy, Oxidation, Lithography, Reactive Plasma Etching, Film Deposition, Ion Implantation, Metallization, Wafer Test and Evaluation, Assembly and Packaging and more

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Management: Andreas Tillmann
Address: Boin GmbH, Haldenweg 25, 89160 Tomerdingen, Germany

Tel +49 (0) 7348 928233
Fax +49 (0) 7348 928234

Angaben entsprechend § 6 Gesetz über die Nutzung von Telediensten (Teledienstegesetz -TDG):

Firma: Boin GmbH
Haldenweg 25
89160 Dornstadt OT Tomerdingen
Bundesrepublik Deutschland

Vertretungsberechtigter: Andreas Tillmann

Registergericht Ulm HRB 3660
Gerichtsstand Ulm
USt-ID-Nr. DE 812 494 843


We hereby declare that we are not associated with any content which may be available on any sites or link pages to which links on this web site may lead. This declaration applies to all links on this web site which lead to other external Internet offers.

Featured Companies

Hologenix - Innovative Products for the Semiconductor Industry.

WAFERMAP - Metrology Software for the Semiconductor Industry

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Last modification:August 14, 2009.