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Events:
Semicon Taiwan 2009
September 30 -October 2, 2009, Taipei World Trade Center, Taiwan
Semicon Europa 2009
October 6-8, 2009, Messe Dresden Germany
PV Taiwan 2009
October 7-9 2009
Semicon Japan 2009
December 2 – December 4, 2009, Makuhari Messe, Chiba, Japan
Semicon Russia 2010
June 14 -16, 2010, World Trade Center, Moscow, Russia
Semiconductor Manufacturing
All about Semiconductor Industry, Semiconductor Materials, Crystal Growth and Wafer Preparation, Contamination Control, Wafer Fabrication, Process Yields, Epitaxy, Oxidation, Lithography, Reactive Plasma Etching, Film Deposition, Ion Implantation, Metallization, Wafer Test and Evaluation, Assembly and Packaging and more
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Index
Assembly Equipment Manufacturers
Backgrind, Slicing, Lapping, Polishing
Ball Placement, Attach Systems
Base Loader Systems
Cleaning,Washing Equipment for Assembly and Packaging
Cut and Down Set, Trim, Form Equipment
Deflashing, Degating Tools
Device Handling, Feeding Systems
Dicing, Sawing, Scribing, Separation Equipment
Die Bonding, Attach Equipment
Die Removal Equipment
Die Sorter, Pick and Place, Flip Chip Placement Systems
Dispensing Systems
Hot Embossing System
Lead Finishing, Straightening Equipment
Lead Frame Taping Systems
Lithography Systems for Wafer Level Packaging, Bumping, 3D Interconnect Aligners
Marking, Imprinting Equipment, Labeling Equipment
Molding, Encapsulation, Decapsulation Equipment
Package Handling, Conveying Equipment
Package Simulation, Characterization Equipment
Printing Equipment, Screen-printing, Alignment, Film Printing
PROM, Memory Programmer Equipment
Solder Reflow, Soldering and Brazing Equipment
Tape Automated Bonding (TAB), Bumped Tape Automated Bonding (BTAB) Equipment
Wafer Level, SOI Bonders, Temporary Bonders, DE-Bonders
Wafer Mount, Taping Equipment
Wire Bonding Equipment
Flat Panel Display Equipment Manufacturers
Alignment Film Coating Equipment
Anodic Oxidation Equipment
Color Pattern Processing Equipment
Cullet Removal Equipment
Laser Treatment, Cutting Systems for Panels and Photocells
Liquid Crystal Injection or Filling Equipment
Low Pressure Plasma Spray (LPPS) Equipment
Luminous Layer Patterning and Sealing Equipment
Panel Alignment, Cell Assembly Equipment
Polarizer Sticking Equipment
Rubbing Equipment
Scribe and Break Equipment
Seal Patterning Equipment
Spacer Spraying Equipment
Inspection & Measurement Equipment Manufacturers
Acoustic Spectroscopy, Electron Spectroscopy for Chemical Analysis (ESCA), Ultrasonic, Acoustical Microscopes
Air Velocity Meter (VA), Humidity and Moisture Sensing
Atomic Force Microscopes (AFM)
Chromatograph
Confocal Scanning Microscope, 3-D Video Microscopes
CV (capacitance-to-voltage) Probe Systems
Defect, Particle, Bump Detection or Inspection
Die Inspection, Die Shear
Electron Microscope (TEM)
Fiber Optic Inspection Instruments
Film Thickness, Thickness Measurement, Ellipsometer
Flat, Notch Finding System
Instruments, Bench Top Test
Leak Detection Systems - Vacuum or Gas
Line Width, Critica Dimension (CD) Measurement
Optical Microscopes
Overlay Measurement
Package Inspection, Lead Scanners
Particle Monitors, Analyzers - Airborne or Liquid
Plate Inspection Equipment
Resistivity Measurement, 4 point probe, Sheet resistance
Spectrometers, Fourier Transform Infrared(FTIR), Attenuated Total Reflectance FTIR(ATR-FTIR), Auger Electron (AES), SIMS
Stress, Refractive Index, Reflectivity and Conductivity Measurement
Thermal Sensing, Measurement, Analysis
Wafer, Substrate Metrology, Topology, Nanotopography,Flatness Measurement
Weight Measurement, Precision Scales
Wire Bonding Inspection, Test
X-ray, XRF, 3-D X-Ray, Lexes Systems
Process Equipment Manufacturers
Bumping Systems
Chemical Mechanical Polishing (CMP), Electro Polishing, Mechanical Polishing Equipment
Cleaning, Washing Equipment for Substrate, Fab Processing
Coat, Develop, Resist Processing, Track Equipment
Crystal Growing and Machining Equipment
Deposition, Chemical Vapor (CVD), MOCVD, PECVD, ALD, LPCVD
Deposition, Physical Vapor (PVD), Sputtering, Evaporation Equipment
Environmental Enclosures, Minienvironments
Epitaxi Equipment, Epi Reactors, Molecular Beam Epitaxy (MBE), Atomic Layer Epitaxi (ALE)
Etching, Stripping, Ashing - Dry and Wet Equipment
Ion Implantation Equipment
Ion, E Beam Milling Etching Equipment
Lithography, Exposure - Aligners, Direct Write Systems, Steppers, Scanners
Plating, Electro Chemical Plating, Deposition Systems
Spin on Glass (SOG), on Dielectric (SOD) Track systems
Thermal Processing - Diffusion, Oxidation, Annealing, RTA, RTP Equipment
Transfer Systems for Wafer, Reticles or FPD´s
Wafer Identification, Marking Equipment
Test Equipment Manufacturers
Burn-In Accessory Systems
Burn-In Systems
Circuit Repair, Design Modification Systems (Focused Ion Beam (FIB), Laser Repair, Redundant Memory Repair Systems
Discrete Component Test Systems
Environmental Stress Systems - Temperature, Humidity, Pressure, HAST
ESD, EMS and Latch-up Systems
Failure Analysis Systems
FPD Test, Measurement, Repair Equipment
Functional Test Systems
Handlers, Postioner Systems
Linear Test Systems
Logic Test Systems
Memory Test Systems
Optical Test Systems
Package Test Systems
Parametric Test Systems
Probe Card Maintenance and Analysis Systems
Probing Equipment (incl. Analytical, Circuit, Manual, E-Beam, Optical, Wafer Probers)
System on a Chip (SOC), Mixed Signal Test Systems
Test Contractor Cleaning, Conditioning Systems
Test Head Manipulators and Docking Stations
Assembly Material Suppliers
Adhesives, Epoxies, Die Attach Compounds, Under fill Materials, Conductive and Non-Conductive
Bonding, Interconnect Materials - Wire, Ribbon, Tape, Lead, Die, Capillaries and Tools
Heat Sinks
Lead Frames and Headers, Etched, Stamped
Marking ink
Molding, Encapsulation, Potting, Resin Materials
Package Substrates, Laminate Material, Film based
Packages, Ceramic and Other High Temp compounds
Packages, Plastic
Preforms, Lids
Printed Circuit Boards (PCB), Printed Wire Boards (PWB) (incl. Laminate, Multilayer, Ceramic, High Temp Circuit Boards
Printing Masks, Screens
Scribe Tools, Saw Blades, Dicing Accessories
Solder, Solder Balls and other Soldering Materials
Tape and Reel Materials
Tape Automated Bonding (TAB) Accessories
Thick Film Pastes, Materials
Thin Film, Dielectric Film Materials
Chemical & Solids Suppliers
Acids, Etchants
Buffers, Alkalis, Bases
Cleaning Chemicals, Solvents, Strippers
DI, UP Water
Dopants, liquid or solid
Other Specialty Chemicals
Photo Resist, Developers and Ancillaries (incl. Adhesio promoter(HMDS), Primer, Anti-Reflective Coating(ARC), BARC, TARC)
Solids
Spin on glass material
Gas Suppliers
Analytical Instrumentation Mixtures
Dopant Gases
Environmental Compliance Mixtures
Etchant Gases
Fuel Gases
Laser Gas Mixtures
Other Specialty, Mixed Gas
Pure and Bulk Gases
Rare, Noble Gases
Reactant Gases
Silicon Precursor Gas
FPD Material Suppliers
Alignment Film Materials
Color Filter Materials
End-Sealing Material
Glass Plates for FPD
Liquid Crystal Materials
Spacer Materials
Mask Making Material Suppliers
Mask and Reticle Handling Products
Mask plate blanks, Glass
Pellicles, Mounting Fixtures
Plate Repair and Materials
Process Material Suppliers
CMP, Grind, Lap, Polish, Abrasive materials
Deposition Supplies
Graphite, Carbon Fiber Carbon (CFC), Process Chamber Components
Ingots
Photo Masks, Finished or Patterned
Plasma, Ion Sources
Plating Materials
Polysilicon or granular polycrystalline silicon, Crystal growing Material
Quartz ware (Silicon Carbide, Fused Quartz Glass, Sapphire) and Ceramic Accessories
Wafer Substrate Suppliers
Compound Semiconductors (GaAs on Silicon, also GaN, InP, SiGe)
Epitaxial, Epi, Gettered, Internal Gettered Wafers
Gallium Arsenide (GaAs), Sapphire Substrates
Prime, Polished, Mirrored Wafers
Silicon on Insulator (SOI) or Silicon on Sapphire (SOS)
Strained silicon, Engineered Substrates
Test, Monitor Wafers, Reclaim or Virgin
Test Material Suppliers
Burn-In Boards, Performance Boards (incl. Low, High Temp and Ceramic)
Probe Cards, DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards)
Structural Circuits, Test, Thermal Fixturing
Test Sockets, Contractors and Contact accessories
Factory Control and Facilities
Factory Monitoring and Control Systems
Chemical, Pure Water, Fluid Handling, Storage, Control, Supply Systems
Chemical, Pure Water, Fluid Monitoring and Control Systems
Data Collection, Building control systems
Electrical, Power Distribution
Emergency (fire) and Security Control Systems
Environmental, Utility Monitoring Systems
Equipment Interface, Communication Protocols
Gas and Other Generation Systems
Gas Handling - Cabinets, Control, Supply Systems
Gas Monitoring Equipment, RGA´s, TGO compliance
Logistics, Floor Control Systems
Process Controls
Waste Control, Effluent Management Systems (Fluid and Gas, Exhaust Conditioning, Scrubbers)
HVAC, Temperature, Humidity, Contamnination Control
Clean Rooms
Contamination Control
HVAC, Temperature, Humidity Systems and Control
HVAC, Temperature, Humidity, Contamination Control
Material Handling Systems
Conveying, Material Handling Systems
Robotics, Transfer Systems
Static, ESD Control
Stockers, Storage, AMHS
Software Manufacturers
Communication Software
Equipment Interace, Communication Protocols
Design Software
CAD - Computer Automated Design
EDA - Electronic Design Automation, Circuit Design
Manufacturing Software
CAM or CIM - Computer Aided Manufacturing, Computer Integrated Manufacturing
Factory Automation, Cell Controller Software
Manufacturing Execution Software (MES)
Production Control software
Test Programs
Yield Management, Process Control Software
Neuer Ordner (2)
Service and Consulting
Building Maintenance
Burn-in Service
Calibration and Reference Standards
Certification, Compliance, Independent Laboratories
Color Filter Manufacturing
Deposition Service
Failure Analysis and other Analytical Services
Ion Implant Service
Laundry Service, Cleanroom Garments and other
Lithography, Patterning service
Machine Shop, Fabrication Service
Mask Making Fabrication and Repair
Measurement, Inspection
Micro Machining (small hole drilling and milling) services
Parts Cleaning, Micro Contamination
Plating, Electro Polishing, Coating, Surface Treatment
Reclaim Services (Evaporation, sputtering source material, Precious metal reclaim, Scrap, Vacuum pump oil, Wafer reclaim)
Repair, Rebuild, Install Equipment Sevices - Independent Contractors
Sawing, Lapping, Grinding, Polishing
Used, Rental Equipment, Inventory - Brokers, Resellers
Wafer Bumping Service
Welding, specialty welding services
References
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Featured Companies
Hologenix - Innovative Products for the Semiconductor Industry.
WAFERMAP - Metrology Software for the Semiconductor Industry
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